300mm silicon wafers

With the arrival of the era of full-scale mass production of 300mm wafers, customers' expectations on silicon wafers are increasingly high. As a pioneer in the world silicon market, Shin-Etsu Handotai (SEH) took the head start of the mass production of 300mm and has established a system ensuring a stable supply to the market. In responding to even higher requirements from the customers for the future, we continue the incessant efforts and challenges for the quality improvements.

<Features> * We have respond to the growing market demand in timely manner with our capacity expansions since the starting of the mass production in February 2001. * Our products can meet the 0.13um design rule process and beyond. * Our product portfolio covers wide range of the customers' various requirements.

<Applications> * Substrates for memory devices, microprocessor devices, etc.

IG-NANA wafers

IG-NANA wafers (annealed wafers) can be used in wide range of device processes, from high-temperature processes to lowtemperature processes. This product can provide high device performances at a reasonable cost.

SOI (Silicon On Insulator) wafers

SOI wafers, with the structure having insulated oxide film under active silicon layer, are promising semiconductor material for leading edge devices such as high speed and low power consumption LSI, smart sensors, smart power devices and MEMS.

Compound semiconductor materials

Shin-Etsu Handotai (SEH) produces light emitting element materials such as gallium phosphide (GaP), gallium arsenide phosphide (GaAsP) and aluminum gallium indium phosphide (AlGaInP) products, which are used in light emitting diodes and lasers in the optoelectronics field. These materials possess unique functions that cannot be found in silicon semiconductors. In addition to these materials, SEH has a lineup of chips, which are one step nearer to devices.

Junction coating resins

Junction coating resins help to improve the reliability of semiconductor devices. They provide electrical protection of semiconductor chips, improve moisture-resistance, reduce mechanical stress, and prevent software error of VLSI.

Epoxy molding compounds

These encapsulating materials provide low stress, low alpha-ray property and high thermal conductivity.They are also environmentfriendly.

Liquid epoxy encapsulating materials

This is a liquid epoxy resin encapsulating material for the protection and adhesion of semiconductor devices.

True spherical shape ultra-fine particulates "ADMAFINE"

ADMAFINE is true spherical shape ultra-fine particulates produced using a special process of oxidize metallic powder. Admatecs, a joint venture of Toyota Motor, Shin-Etsu Chemical, Shin-Etsu Quartz Products and Tatsumori, succeeded in commercial production of this product as a pioneer in the world.

Synthetic quartz photomask substrates

This substrate excels in the permeability and low thermal expansibility in the far-ultraviolet range. It is suitable as photomask substrates for optical lithography and other applications that require ultra-high purity and high precision polishing (flatness processing at a submicron level).

Synthetic quartz wafers

This wafer has excellent thermal resistance and light transmission properties. It is most suitable as wafers for high temperature poly-Si TFT-LCD and other applications that require high purity and high precision polishing.

Semi-transparent quartz crucibles for
silicon single crystal pulling applications

The same silica raw material as transparent quartz glass is used.
The manufacturing method is unique.

Quartz glass for semiconductor production processes

Technological innovation continues in the field of semiconductor; with horizontal furnaces being replaced by vertical furnaces, wafer size evolving toward larger diameters, and so forth. We are meeting the changing demands by a broad range of product configuration and excellent processing technology.

Silicon wafer carrier
and semiconductor-material container

300mm Front Opening Unified Pod-FOUP
300mm Front Opening Shipping Box-FOSB

These are carrier and containers for storing and transporting highpurity materials such as silicon wafers, synthetic quartz mask substrates and other high quality chemical material used in semiconductor industry.

Silicon wafer case pouches

These are packaging bags for semiconductor silicon wafer cases, for which high levels of cleanliness and air-tightness are required.

Photoresists

Drawing upon the extensive electronic material expertise acquired in the chemical manufacturing field, we offer the latest high-quality and high-performance KrF, ArF and F2 photoresists and other materials related to semiconductor production processes.

Pellicles

Pellicle is a high-quality cover for the protection of photomasks against dust, which was developed based on the know-how accumulated from the development and manufacture of various electronic materials. In addition to the grade for g/i-line and the KrF excimer laser grade, the ArF excimer laser grade is also available. Through consolidated quality design, we are equipped to meet all the high level needs of our customers.

Pyrolytic boron nitride (PBN)

The product is a kind of ceramics manufactured with a thermal decomposition under reduced pressure. It is mainly used for breeding III-V compound semiconductor crystals such as GaAs, which are attracting more and more attention as an element for the mobile communication MMIC or for optical devices.

PG/PBN heater

The product is a ceramic heater made by laminating two kinds of ceramics (PBN, PG), manufactured by the pressure reduced heat decomposition CVD method.

High-Purity Silicon Parts

High-purity silicon parts are used in the electrodes in the upper part of the etching equipment used in the semiconductor production process and in the focus ring which ensures uniformity of etching on the periphery of the wafer. Shin-Etsu Chemical handles the entire production process; from silicon ingots to silicon parts, and provides a steady supply of large diameter, high purity products.

Carrier tapes

It is the package materials for transporting semiconductor devices and various surface-mounting electronic devices(SMD).

Silicon carbide abrasive powder

"SHINANO-RUNDUM" is an abrasive powder produced by the following procedures. Only the selected crystal portion is extracted from the ingot of black or green silicon carbide. They are crushed, ground to fine powder, treated chemically, graded, filtered and dried.

High-purity silane

This is used in a wide range of industries such as electronics, chemical, ceramics, and metal industries. A lineup of tetrachlorosilane, richlorosilane, dichlorosilane etc. is available.

Shin-Etsu high-purity organometallics

Organometallics precursors are used to produce thin film compound semiconductors with MOCVD technique. We have seven products, which are TMGa, TEGa, TMIn, TMAl, DMZn, DEZn and TBP.

High-purity chloromethane

Using natural gas found near the Naoetsu Plant of Shin-Etsu Chemical, chlorine, methanol, and hydrochloric acid as raw materials, our unique reaction technology, advanced refining techniques, and development of excellent stabilizers enable us to supply products at stable, high quality. The products include methylchloride, methylenechloride, and chloroform.