soi


SEH (Shin-Etsu Handotai), a subsidiary of Shin-Etsu Chemical, Co., Ltd. is the biggest silicon wafer production company in the world. Here SEH shows the latest innovative, value-added silicon wafers called SOI (= Silicon On Insulator).

SOI wafers are promising semiconductor materials for leading edge devices such as low power and high speed LSIs, smart sensors, and smart power devices. SEH has been providing several kinds of SOI wafers to meet various customer's requirements.

SEH started development of SOI wafers in 1988. We began with bonded SOI wafers by precisely controlled grinding and polishing technology, responding to customer's high quality requirements. We introduced PACE(plasma assisted chemical etching) technology in 1994 for improvement of SOI thickness uniformity, and Smart-Cut^(R) technology for thin SOI wafer production at low cost in 1997

All SOI products by SEH start from bonding process.

SEH produces SOI wafers according to customers' requirements, as much as possible. Adaptive parameters in production of SOI wafers are itemized below:
•SOI layer thickness and resistivity
•Specification of base wafer
•Buried oxide layer thickness
•Location of bonded interface

If you have questions or comments, or if you need inquiry form of SOI wafers,
please contact us by e-mail at
sec-pr@shinetsu.co.jp