A UNIBOND(R) wafer is an SOI wafer produced by Smart-Cut(R) technology.

•excellent thickness uniformity of SOI layer. •SOI crystal quality equivalent to bulk Si wafer. •BOX quality equivalent to thermal oxide. •low cost and volume supply. • low power & high speed LSIs in intelligent communication tools and MPU. SEH signed a long term alliance with French company, SOITEC, partner of the inventor for SMART CUT(R) process. Since both SEH and SOITEC have extensive experience in SOI technology, each company will be able to maximize its strength through technology cooperation. Through this alliance, UNIBOND(R) wafer will be available from SEH soon. • SOITEC's HP
Standard SOI wafers   Parameters Size Diameter (mm) 200 SOI thickness (nm) 100-200 uniformity (max-min) <5% type resistivity (ohm cm) orientation P-type 14-22, 8.5-11.5 <100> BOX thickness(nm) 400 uniformity (max-min) <2.5% Base wafer type resistivity (ohm cm) orientation thickness(um) P-type 14-22, 8.5-11.5 <100> 725 HF defect, Secco defect To be specified Pipe density none Roughness(nm) (rms) (max-min) 0.2 1.5 Metal contamination (/cm2) <2E10 Edge exclusion(mm) <3		Customized SOI wafers Parameters Size Diameter (mm) 200 SOI thickness (nm) 80 -1500 uniformity (max-min) <5% type resistivity (ohm cm) orientation P-type arbitrary <100> BOX thickness(nm) 100-3000 uniformity (max-min) <2.5% Base wafer type resistivity (ohm cm) orientation thickness(um) P-type arbitrary <100> 725 HF defect, Secco defect To be specified Pipe density none Roughness(nm) (rms) (max-min) 0.2 1.5 Metal contamination (/cm2) <2E10 Edge exclusion(mm) <3
* For more information about UNIBOND(R) wafer outside Japan, please contact : (Please notice underbar between first and family name.) 1. West coast USA Irina_Bondarenko@sehamerica.com Tel. +1-360-883-7608 Fax. +1-360-883-7649 ken_curtis@sehamerica.com Tel. +1-360-883-7636 Fax. +1-360-883-7645 2. East coast USA Mark_Lima@sehamerica.com Tel. +1-973-398-3353 Fax. +1-973-398-3037 3. UK dave_alston@sehe.com Tel. +44-1506-41-5555 Fax. +44-1506-41-7171 4. France alain_vigouroux@sehe.com Tel. +33-1-39-58-22-22 Fax. +33-1-39-58-81-77 UNIBOND(R) wafers from 100 mm to 300 mm

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